Molding SMD Power Inductors - SMS0850 Series
Product Overview
The SMS0850 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors featuring a thin design with low DC resistance and exceptional current handling capabilities. Designed with magnetic shielding for strong anti-electromagnetic interference, these inductors are ideal for high-density installations. Their integral construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. Utilizing low-loss alloy powder for die-casting results in low impedance and small parasitic capacitance, contributing to high efficiency and reduced core eddy-current loss. These inductors operate at frequencies up to 1-2MHz and are compliant with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS0850
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: China
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Technical Specifications
Product Identification: SMS 0850 100 M T
- Type: SMS (Molding SMD Power Inductor)
- External Dimensions (LWH): 0850 (8.58.05.0 mm)
- Inductance: e.g., 10 uH
- Inductance Tolerance: M (20%)
- Packing: T (Tape & Reel), B (Bulk Package)
Environmental Data
- Operating Temperature: -55 to +125 (Including coils self-temperature rise)
Test Equipment
- Inductance (L): WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Shape and Dimensions
| Part No | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) |
| SMS0850 | 8.50.50 | 8.00.30 | 5.00 Max | 3.0 0.30 | 1.8 0.30 | 4.5 | 9.5 | 3.5 |
Electrical Characteristics (SMS0850 Series at 25)
| Part No | Inductance L(H) | Tol '@0A | DCR (m) Typical | DCR (m) Max | Saturation Current Typical (A) | Heat Rating Current Typical (A) |
| SMS0850-R56M | 0.56 | 20% | 3.0 | 4.5 | 30.00 | 24.00 |
| SMS0850-R68M | 0.68 | 20% | 3.6 | 6.0 | 25.00 | 23.00 |
| SMS0850-1R0M | 1.0 | 20% | 4.1 | 5.5 | 20.00 | 19.00 |
| SMS0850-1R5M | 1.5 | 20% | 5.0 | 7.0 | 19.00 | 17.00 |
| SMS0850-2R2M | 2.2 | 20% | 8.2 | 12.0 | 16.00 | 14.00 |
| SMS0850-3R3M | 3.3 | 20% | 11.0 | 15.0 | 13.00 | 12.00 |
| SMS0850-4R7M | 4.7 | 20% | 15.0 | 20.0 | 12.00 | 9.50 |
| SMS0850-5R6M | 5.6 | 20% | 25.0 | 28.5 | 11.00 | 9.00 |
| SMS0850-100M | 10 | 20% | 35.0 | 45.0 | 8.00 | 6.20 |
| SMS0850-150M | 15 | 20% | 55.0 | 65.0 | 7.00 | 5.40 |
| SMS0850-220M | 22 | 20% | 78.0 | 88.0 | 5.50 | 4.80 |
| SMS0850-330M | 33 | 20% | 120.0 | 140.0 | 6.00 | 3.50 |
| SMS0850-470M | 47 | 20% | 177.0 | 190.0 | 4.00 | 2.90 |
| SMS0850-560M | 56 | 20% | 188.0 | 226.0 | 3.00 | 2.50 |
| SMS0850-680M | 68 | 20% | 280.0 | 310.0 | 2.80 | 2.00 |
Inductance Tolerance Codes
- J: 5%
- K: 10%
- L: 15%
- M: 20%
- P: 25%
- N: 30%
Definitions
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Packaging Specifications
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
| SMS0850 | 24.0 | 12.0 | 11.5 | 24.4 | 100 | 13 | 330 | 1000 | 2000 | 8000 |
Reliability Testing
Terminal Strength: Tested according to GB/T 2423.60-2008 for SMT and DIP terminals with specified forces and durations. Meets requirements without loose terminals.
Resistance to Flexure: Tested according to JIS C 5321:1997. No visible mechanical damage, meets flexure requirements.
Dropping: Tested according to GB/T 2423.7-2018. No case deformation or appearance change, no short or open circuits.
Solderability: Tested according to GB/T 2423.28-2005. Minimum 95% solder coverage on terminals after dipping in solder at 2402 for 3 sec.
Vibration: Tested according to GB/T 2423.10-2019. No visible mechanical damage, inductance change within 10%, Q factor change within 20%.
Thermal Shock: Tested according to GB/T 2423.22-2012 Method Na. 100 cycles of temperature extremes (-55~40 to 85~125). No visible mechanical damage, inductance change within 10% (or 30% for Mn-Zn), Q factor change within 20%.
Low temperature Storage: Tested according to GB/T 2423.1-2008 Method Ab. Storage at -55~-402 for 962 hours. No visible mechanical damage, inductance change within 10% (or 30% for Mn-Zn), Q factor change within 20%.
High temperature Storage: Tested according to GB/T 2423.2-2008 Method Bb. Storage at 125~852 for 962 hours. No visible mechanical damage, inductance change within 10% (or 30% for Mn-Zn), Q factor change within 20%.
Damp Heat (Steady States): Tested according to GB/T 2423.3-2016. Exposure to 602 and 90% to 95% RH for 962 hours. No visible mechanical damage, inductance change within 10% (or 30% for Mn-Zn), Q factor change within 20%.
Heat endurance of Reflow soldering: Tested according to GJB 360B-2009. Subjected to reflow soldering twice with peak temperature 260+0/-5. No significant defects, L/L 10% (or 30% for Mn-Zn), Q/Q 30%, DCR/DCR 10%.
Resistance to solvent test: Tested according to IEC 68-2-45:1993. Dipped in IPA solvent for 50.5 min, dried for 5 min, brushed 10 times. No case deformation or appearance change.
Overload test: Tested according to JIS C5311-6.13. Applied twice rated current for 5 minutes. No smoke, odor, or fire; characteristics normal after test.
Voltage resistance test: Tested according to MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. No breakdown during test; characteristics normal after test.
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Users should adjust and confirm conditions based on their specific equipment and process.
Reminders for Using These Products
- Storage: Within 12 months, at 5~40C and 35~65% RH.
- Environment: Avoid gas corrosive environments (salt, acid, alkali).
- Handling: Avoid touching terminals with bare hands due to oils. Handle carefully to prevent damage.
- Terminals: Do not bend terminals excessively to prevent wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose to magnets or magnetic fields.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions. Overheating may cause issues.
- Thermal Design: Account for self-heating when power is ON.
- Layout: For non-magnetic shield types, carefully lay out coils to avoid malfunction due to magnetic interference.
2410121647_LanTu-Micro-SMS0850-150MT_C7602867.pdf
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Molding SMD power inductors LanTu Micro SMS0850-150MT designed for PDA notebook desktop and server applications Images
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