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LanTu Micro SMS0420 6R8MT power inductor featuring composite structure and low core eddy current loss

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LanTu Micro SMS0420 6R8MT power inductor featuring composite structure and low core eddy current loss

Current - Saturation (Isat) : 2.5A

Description : 2.5A SMD,4.6x4.2mm Fixed Inductors RoHS

Mfr. Part # : SMS0420-6R8MT

Model Number : SMS0420-6R8MT

Package : SMD,4.6x4.2mm

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Product Overview

The SMS0420 Series Ultra-high current SMD power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installation with a thin profile, low DC resistance, and ultra-high current capabilities. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability through an integral construction that provides excellent vibration resistance. Their composite structure ensures ultra-low buzz noise, while the low-loss alloy powder die-casting contributes to low impedance and small parasitic capacitance, leading to high efficiency and reduced core eddy-current loss. These inductors operate at frequencies up to 3MHz and have an absolute maximum voltage of 30VDC, complying with RoHS, Halogen Free, and REACH standards. They are ideal for applications such as PDAs, notebooks, desktop and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Product Type: Molding SMD Power Inductor
  • Series: SMS0420 Series
  • Certifications: RoHS, Halogen Free, REACH Compliance

Technical Specifications

General Specifications

Specification Value
Operating Temperature -55 to +125 (Including coils self-temperature rise)
Absolute Maximum Voltage 30VDC
Frequency Range Up to 3MHz

Electrical Characteristics (Electrical specifications at 25)

Part No. Inductance (H) @ 0A Tolerance DCR (m) Typical Saturation Current (A) Typical Heat Rating Current (A) Typical
SMS0420-R10M 0.10 20% 3.5 25.00 13.00
SMS0420-R22M 0.22 20% 6.0 13.00 9.50
SMS0420-R33M 0.33 20% 8.0 11.00 7.00
SMS0420-R47M 0.47 20% 12.0 9.50 8.00
SMS0420-R56M 0.56 20% 14.0 9.00 7.00
SMS0420-R68M 0.68 20% 18.0 8.00 7.00
SMS0420-1R0M 1.0 20% 24.0 7.00 6.00
SMS0420-1R2M 1.2 20% 25.0 6.00 5.50
SMS0420-1R5M 1.5 20% 40.0 5.50 5.00
SMS0420-2R2M 2.2 20% 52.0 5.00 4.50
SMS0420-3R3M 3.3 20% 70.0 4.00 3.50
SMS0420-4R7M 4.7 20% 105.0 3.00 2.80
SMS0420-6R8M 6.8 20% 120.0 2.50 2.40
SMS0420-100M 10 20% 220.0 2.00 1.60
SMS0420-150M 15 20% 280.0 1.90 1.40
SMS0420-220M 22 20% 450.0 1.50 1.20

Inductance Tolerance Options

Code Tolerance
J 5%
K 10%
L 15%
M 20%
P 25%
N 30%

Dimensions (mm)

Part No. A (L) B (W) C (H) D (Typ) E (Typ) F (Typ) G (Typ) H (Typ)
SMS0420 4.600.30 4.200.20 2.00Max 1.50Typ 0.80 Typ 2.20 5.20 2.50

Product Identification

SMS 0420 100 M T

  • SMS: Type
  • 0420: External Dimensions (LWH) (mm)
  • 100: Inductance (e.g., 100 means 10 H)
  • M: Inductance Tolerance (M = 20%)
  • T: Packing Type (T = Tape & Reel)

Packaging

Packing Type Description
Bulk Package B
Tape & Reel T

Tape and Reel Specifications

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) Reel (PCS) Inside Box (PCS) Outside Carton (PCS)
SMS0420 12.0 8.0 5.5 12.4 100 13 330 3000 12,000 48,000

Reliability Testing

Details on Terminal Strength, Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low temperature Storage, High temperature Storage, Damp Heat, Heat endurance of Reflow soldering, Resistance to solvent test, Overload test, and Voltage resistance test are available, with specific requirements and test methods outlined in the original document.

Recommended Reflow Soldering Curve

Refer to the provided graph for recommended reflow conditions. Users should adjust and confirm these conditions based on their specific environment and equipment.

Reminders for Using These Products

  • Storage period is within 12 months under conditions: temperature 5~40C, humidity 35~65% RH or less.
  • Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
  • Avoid direct contact with terminals with bare hands due to oil secretions.
  • Handle products carefully to prevent damage from dropping or improper removal.
  • Do not bend terminals with excessive stress to avoid wire fracture.
  • Do not rinse coils; contact the manufacturer if cleaning is necessary.
  • Do not expose products to magnets or magnetic fields.
  • Preheat components before soldering; ensure the temperature difference between solder and chip does not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance deterioration, or lifespan shortening.
  • Allow for sufficient thermal design margin due to self-heating when power is on.
  • For non-magnetic shield types, careful layout is required to prevent malfunctions due to magnetic interference.

2410121635_LanTu-Micro-SMS0420-6R8MT_C5127352.pdf


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