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Multilayer Chip Ferrite Power Inductor FH CMP321609XD100MT Featuring Silver Layer Terminal Electrodes

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Multilayer Chip Ferrite Power Inductor FH CMP321609XD100MT Featuring Silver Layer Terminal Electrodes

Current - Saturation (Isat) : -

Description : 1206 Fixed Inductors RoHS

Mfr. Part # : CMP321609XD100MT

Model Number : CMP321609XD100MT

Package : 1206

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Product Overview

The CMP321609-D Series is a Multilayer Chip Ferrite Power Inductor designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes with silver layers and Ni/Sn plating. They offer reliable performance and are suitable for reflow soldering processes. The series is manufactured to meet stringent quality and reliability standards, ensuring consistent performance in demanding environments.

Product Attributes

  • Product Type: Multilayer Chip Ferrite Power Inductor
  • Series: CMP321609-D Series
  • Manufacturer: (Implied, not explicitly stated)
  • Material (Body): Ferrite (Ni-Cu-Zn system) or Ceramic
  • Material (Inner Electrode): Pure Silver (Ag)
  • Material (Terminal Electrode): Silver Layer (Ag) with Ni/Sn Plating
  • Packaging: Tape & Reel (T)
  • Certifications: RoHS compliant (if marked "Unitary lead free")

Technical Specifications

Part Number Tolerance (%) Inductance (H) DC Resistance (RDC) () max Test Frequency (MHz) Test Voltage (mV) Self-Resonant Frequency (SRF) (MHz) min Rated Current (mA) max Dimensions (LWT) (mm)
CMP321609UD1R0MT 20 1.0 0.15 1 50 60 1200 3.21.60.9
CMP321609UD1R2MT 20 1.2 0.15 1 50 65 1200 3.21.60.9
CMP321609UD1R5MT 20 1.5 0.17 1 50 60 1000 3.21.60.9
CMP321609UD1R8MT 20 1.8 0.24 1 50 55 900 3.21.60.9
CMP321609UD2R2MT 20 2.2 0.24 1 50 50 900 3.21.60.9
CMP321609UD2R7MT 20 2.7 0.30 1 50 45 800 3.21.60.9
CMP321609UD3R3MT 20 3.3 0.30 1 50 41 800 3.21.60.9
CMP321609UD3R9MT 20 3.9 0.38 1 50 38 700 3.21.60.9
CMP321609UD4R7MT 20 4.7 0.38 1 50 35 700 3.21.60.9
CMP321609UD5R6MT 20 5.6 0.45 1 50 32 500 3.21.60.9
CMP321609XD6R8MT 20 6.8 0.45 1 50 29 500 3.21.60.9
CMP321609XD8R2MT 20 8.2 0.55 1 50 26 300 3.21.60.9
CMP321609XD100MT 20 10 0.55 1 50 24 300 3.21.60.9
CMP321609XD120MT 20 12 0.55 1 50 22 300 3.21.60.9
CMP321609JD150MT 20 15 0.65 1 50 19 100 3.21.60.9
CMP321609JD180MT 20 18 0.65 1 50 18 100 3.21.60.9

Reliability Testing Items

Item Requirements Test Methods and Remarks
Operating Temperature Range -40+85 -
Solder ability At least 95% of terminal electrode should be covered with solder Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth: 10mm; Duration: 51s; Dip performance to a flux of about: 3 ~ 5 s
Resistance to Soldering Heat Inductance change: UD: 20%, XD: 25%, JD: 30% Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth: 10mm; Duration: 101s; Dip performance to a flux of about: 3 ~ 5 s
Adhesion of electrode The termination and body should be no damage. Applied force: 10N for 3216 series; Keep time: 101S
Low temperature resistance No mechanical damage. Inductance change: within 10% Temperature: -402; Testing time: 1000 +24/-0 h
Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s
Vibration No mechanical damage. Inductance change: within 10% Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions; Frequency range: 10Hz to 55Hz to 10Hz for 1min.
High temperature resistance No mechanical damage. Inductance change: within 10% Testing time: 1000 +24/-0 h; Temperature: 852
Static Humidity No mechanical damage. Inductance change: within 10% Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +24/-0 h
High temperature load No mechanical damage. Inductance change: within 10% Impose current: rated current; Testing time: 1000 +24/-0 h; Temperature: 852
Temperature Shock No mechanical damage. Inductance change: within 10% Temperature: -40 for 303min +85 for 303min; Number of cycles: 32

Product Packaging

Size Pieces per Reel Pieces per Box Pieces per Case
321609 4000 40000 240000

Recommended Soldering Conditions

Products are suitable for reflow soldering.

  • Soldering Conditions: Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150 max. Cooling into solvent after soldering should be limited to 100 max.
  • Iron Soldering: Soldering Iron Temperature: 350 (Max); Power: 30W (Max); Soldering Time: < 5S. Take care not to apply the tip of the soldering iron to the terminal electrodes.

Cleaning Conditions

  • Cleaning temperature: 60 (max)
  • Cleaning time: 1 minute (min)
  • Ultrasonic output power: 200W (max)

Storage Requirements

  • Storage Period: Within 1 year from the manufacturing inspection date. If exceeding 1 year, solderability should be checked.
  • Storage Conditions: Temperature: -10 to +40, Relative Humidity: 30% to 70%. Avoid corrosive substances, humidity, dust, heat shock, vibration, and direct sunlight. Products should be stored in airtight packaging.

Usage Of ODS (Ozone Depleting Substances)

The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in the production process.

Notes

  • If the product is marked "Unitary lead free", it complies with RoHS directive requirements.
  • This product specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when this product is mounted.
  • The company cannot warrant against failure caused by any use of the product that deviates from the intended use as described in this product specification.

2410121310_FH-CMP321609XD100MT_C395029.pdf


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